Thermal Design and CFD Analysis of Closed Loop Pulsating Heat pipe for High Density Heat Flux Electronic Components of Space Application

Authors

  • Manjunath H. S. Dr. M. Shivashankar  Department of Mechanical Engineering, Siddaganga Institute of Technology, Tumakuru, Karnataka, India

Keywords:

Heat Pipe, Loop Heat Pipe, Closed Loop Pulsating Heat Pipe, Microgravity, Space Environment, Aluminum 6061 T6 Alloy, Volume of Fluid.

Abstract

Space environment is found to be vacuum and heat transfer takes place only through Conduction and Radiation, The heat generated in the high heat flux electronic components of space borne Radar should distributed to the spacecraft or satellite box and then it is radiated to the space, for high heat flux electronics in space application Heat pipe is used as an heat transfer device, The CLPHP is the wickless heat pipe with diameter bigger then the capillary limit, the device is made of Aluminium material with inner diameter and outer diameter of 3mm and 4mm respectively, bent into 4 turns at evaporator,FC-72 as Working fluid and the heat load at the evaporator of 160 W and constant heat flux of 3w/cm2, the analysis is carried out in Ansys Fluent in microgravity condition, in microgravity condition due to the absence of gravitational force and buoyance force will activates the liquid slugs and vapour bubbles due to pressure variation, the effect of gravity on the performance of CLPHP is negligible, the thermal resistance is 0.15K/W, the analysis is carried out at 40%, 50%, and 60% filling ratio, the performance is maximum at 50% filling ratio, the CLPHP has extraordinary space adaptability.

References

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Published

2018-04-30

Issue

Section

Research Articles

How to Cite

[1]
Manjunath H. S. Dr. M. Shivashankar, " Thermal Design and CFD Analysis of Closed Loop Pulsating Heat pipe for High Density Heat Flux Electronic Components of Space Application, IInternational Journal of Scientific Research in Mechanical and Materials Engineering(IJSRMME), ISSN : 2456-3307, Volume 2, Issue 1, pp.33-39 , -2018.